Copper Electroplating

PCB Copper Electroplating

CUPROSTAR® copper electroplating systems are specially formulated to address demanding PCB manufacturing requirements to deposit copper on smaller, more complex boards with higher layer counts. Our bright and satin CUPROSTAR acid copper systems deliver superior throwing power and offer ease of operation and bath maintenance.  Each system delivers a low cost of ownership, while consistently producing fine crystalline and ductile deposits.

CUPROSTAR CVF processes are specially formulated for HDI any-layer build-up. Used as part of an EnFILL® system , the processes are specially formulated to address demanding PCB manufacturing requirements to deposit copper on smaller, more complex boards with higher layer counts. Super Fill and Partial Fill process options deliver high productivity and reliability, while offering ease of operation and bath maintenance.

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